Earthing Compounds

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Earthing Compounds

Earthing Compounds

Product Specification

Earth Enhancing Compound (IEEE 80:2000 Clause 14.5.d)

  • lonic compound

Salts creates ions for easy conduction

  • Dispersion compound

Spreads the salts equally in the earth pit

  • Expansion compound

Expands 18 to 20 times and removes entrapped air to create strong connection between rod and soil

  • Diffusion compound

Diffuses into soil pores and creates conductive silicate roots enlarging conductive zone of earth pit.

  • Hygroscopic compound

Absorbs atmospheric & surrounding moisture and retain it in the soil

  • Other Patented compound