Earthing Compounds

Product Specification

Earth Enhancing Compound (IEEE 80:2000 Clause 14.5.d)

• lonic compound

Salts creates ions for easy conduction

• Dispersion compound

Spreads the salts equally in the earth pit

• Expansion compound

Expands 18 to 20 times and removes entrapped air to create strong connection between rod and soil

• Diffusion compound

Diffuses into soil pores and creates conductive silicate roots enlarging conductive zone of earth pit.

• Hygroscopic compound

Absorbs atmospheric & surrounding moisture and retain it in the soil

• Other Patented compound